3DVLSI OPEN WORKSHOP
CEA-Leti, IRT NanoElec and Qualcomm are pleased to invite you for a new 3DVLSI Open Workshop dedicated to high density 3D-IC and CoolCubeTM (Monolithic/Sequential 3D) technologies.
The workshop is held Tuesday, Octover 16 at the same location as the IEEE S3S Conference.
The 3DVLSI project’s goals include building a complete ecosystem that takes the technology from design to fabrication. A first 3DVLSI open Workshop was organized back in 2014. Since then, the workshop has offered presentations from Applied Materials, ARM, Atrenta, Cadence, CEA-Leti, Georgia Tech, Globalfoundries, HPE, Intel, Mentor Graphics, Monolithic3D, Qualcomm, Stanford University, TSMC and many more.
Registration is free and available to S3S attendees.
However, since seating is limited, registration is by invitation only. If interested, please send an email to email@example.com.