IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S)

“Energy Efficient Technology for the Internet of Things”
2016 Program

A special focus area of the Conference in 2016 will be on energy efficient computation and communication to empower small systems. This is a timely topic given projections that the number of internet–connected devices will grow to 75 billion by 2020. Energy-efficiency is key to enabling small, battery-powered sensors and wireless connectivity hubs. The IEEE S3S organizers are pleased that the core technologies of the S3S Conference are sure to play critical roles in efficient computation and communication in energy starved systems.

The conference will hold a Keynote session featuring distinguished speakers from industry and academia.

The Hot Topics session, focused on the Internet of Things. It will illustrate the synergy between, and relevance of the SOI, Sub Vt and 3D axes of the conference as part of the roadmap for the coming years.

Internet of everything encompasses a broad spectrum of applications such as smart homes, smart cars, smart cities, smart sensor networks, personal health care and e-medical devices. Meeting these widely segmented market needs requires a comprehensive understanding of system and functional diversity, computation and communication complexity, and increasing cyber security. In this special topics session, we will receive key actors of this segment, who explore novel system concepts, address design and implementation requirements in some of the following areas,
• Integrated always on sensing system
• Integrated computer vision system
• Ultra low power wearable system
• Machine learning architecture and hardware
• Cognitive connectivity system
• Embedded hardware security
• Portable/implantable medical device
• Personal mobile health care system
• Integrated bio-sensing technology and system
• Connected home solution
• Smart automotive system
• IoT network reliability and hardware implementation

The IEEE S3S conference will hold a joint event with the SOI Consortium, including an FDSOI tutorial, presentations and a panel discussion. Additional details will be given at a later date.

The regular parallel technical sessions as well as the joint poster and late news sessions will once more be part of the program.
This year we have expanded the range of the “Subthreshold Microelectronics” area to “Low-Voltage Microelectronics”, as with continued device scaling and lowering of threshold voltage the most energy efficient operating point is now often near-threshold and not below threshold.

Silicon On Insulator (SOI) Ever increasing demand and advances in SOI and related technologies make it essential to meet and discuss new gains and accomplishments in the field. For over 35 years our conference has been the premier meeting of engineers and scientists dedicated to current trends in Silicon-On-Insulators technology. Previously unpublished papers are solicited in all areas of SOI technology and related devices, circuits and applications, including:
• Device Physics and Modeling
• Substrate Engineering
• High-Voltage Devices
• Fully-Depleted / Thin-Body Devices
• Advanced Materials, Substrate & Process Integration
• Analog and RF Technologies
• Photonics
• SOI Circuit Applications
• New SOI Structures, Circuits and Applications
• Device reliability and characterization
• Asynchronous Circuits
• RFID Technology and Applications
• Sensors, NEMS, and MEMS
• SOI-specific design
• SOI and FDSOI Manufacturability and Process Integration
Low-Voltage Microelectronics Ultra-low-power microelectronics will expand the technological capability of handheld and wireless devices by dramatically improving battery life and portability. Ubiquitous sensor networks, RFID tags, implanted medical devices, portable biosensors, handheld devices, and space-based applications are among those that would benefit from extremely low power circuits. The most efficient way to reduce power is to reduce operating voltage, which can result in energy savings of more than 90% compared to conventional low-power microelectronics. Papers are solicited in the following technical focus areas, but research or concepts in any area of low-voltage microelectronics will be considered:

• Unattended Remote Sensors
• Low Voltage Memory Technologies
• Space-Based Sensors
• Radiation Effects
• Novel Device and Fabrication Technology
• Transistor Variability and Mitigation
• Low-Voltage Handheld/wireless systems
• Energy Harvesting Techniques
• Ultra-Low-Power Digital Computation
• Asynchronous Circuits
• Analog and RF Technologies
• Biomedical Devices
• Energy Management Circuits
• Robust Circuit Design

3D Integration 3D Integration, including monolithic 3D IC or sequential 3D IC, allows us to scale integrated circuits “orthogonally” in addition to classical 2D device and interconnect scaling. This session will address the unique features of such stacking with special emphasis on wafer level bonding as a reliable and cost effective method, similar to the creation of SOI wafers. We will cover fabrication techniques, bonding methods as well as design and test methodologies. Novel inter-strata interconnect schemes will also be discussed. Previously unpublished papers are solicited in all of the above areas related to 3D implementation including:

• Low Thermal Budget Processing
• 3D Manufacturing and Logistics
• Processes for Multi Wafer Stacking
• Reliability of 3D Circuits
• 3D IC EDA and Design Technology
• Cost Analysis of 3D Architectures
• Fault Tolerant 3D Designs
• Integration of heterogeneous substrates, devices, and architectures

(c) Copyright 2015 Joyce Lloyd, IMF