Late News Papers

Papers of exceptional merit are currently being accepted for our Late News Sessions.
Submitted papers should follow the guidelines of our initial Call for Papers.
Papers need to be received no later than 11:59 pm PDT 17 August 2018 for consideration.

2018 Call for Papers

The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S)

2018 IEEE S3S Call for Papers

Papers in the following areas are requested:
Silicon on Insulator (SOI)
3D Integration
Low-Voltage Devices
Low-Power Circuits


• Fully Depleted Silicon on Insulator Technology
• Advanced Materials, Substrate and Processes
• Device Physics, Characterization and Modelling
• Sensors, MEMS, BioMEMS
• Non-Digital Devices and Applications (RF, High-Voltage, Photonics, Analog…)
• Novel SOI Structures, Circuits and Applications
• SOI Design, Circuits and Applications


• System in Package
• Through Silicon Via (TSV) Technology
• 3D System Integration
• Fabrication Techniques and Bonding Methods
• Design and Test Methodologies
• Processes for Multi Wafer Stacking
• 3D IC EDA and Design Technologies
• Heterogeneous Structures
• 3D Manufacturing and Logistics
• Reliability of 3D Circuits
• Fault Tolerant 3D Designs


• Low-Dimensional (1D,2D) Transistors
• Tunnel FETs
• Negative Capacitance FETs
• Piezoelectric FETs
• Nano-Electromechanical Switches
• Low Voltage Memory Technologies
• Metal-Insulator Transitional Devices
• Spintronic Devices


• Low-Power and Ultra-Low-Power Digital Circuits
• Energy Efficient Designs and Methodologies
• Power Management Techniques
• Asynchronous Circuits
• Energy Harvesting Solutions
• Low Power, Reliable and Resilient Solutions
• Analog/Mixed-Signal Circuits for Wireless Communications
• Innovative ICs
• Near Threshold and Sub-Threshold Designs
• Low Power Applications: IoT, Automotive, Data Mining…

2018 Call for Papers (download) Late News Papers will be accepted until 11:59pm PDT 17 August 2018
Preparation of Abstracts
How to submit your abstract