2017 Call for Papers (download)

The IEEE SOI-3D-Subthreshold Microelectronics Technology
Unified Conference (IEEE S3S)

Paper Submission Information

Prospective authors should prepare a 2 to 3 page, camera ready abstract of their original work including illustration
(see Preparation of Abstracts for requirements and sample abstract). Abstracts should be based on the same criteria as the 2017 Call for Papers.

Submissions must be in Adobe PDF format and attached to a cover email.
The Cover E-Mail MUST Contain the Following:
Designated contact author
Full Name (first name and last name)
Mailing Address
Telephone Number (include country code if a non US number)
Email Address

Presenting author (even if it is the same as the contact author)
Full Name (first name and last name)
Email Address

Presentation Preference: Oral or Poster
and Category of submission: 3D Integration / Silicon on Insulator (SOI) / Low-Voltage Microelectronics

Authors may submit more than one paper to the conference. Each paper must be submitted separately following the above criteria.

Abstract acceptance will be based on Quality, Originality and Significance. Abstract submissions must be emailed to papers@s3sconference.org

Notification and Communication

Submissions will be acknowledged via email to the designated contact author. If you submit a paper and do not receive notification within 2 business days, please email manager@s3sconference.org directly to follow up.

Contact authors will be notified of the Committee’s decision no later than 1 July, 2017

Download the 2017 Call for Papers Deadline Extended to June 12, 2017
Preparation of Abstracts  

(c) Copyright 2015 Joyce Lloyd, IMF