Abstract Submission

2019 Call for Papers

The IEEE SOI-3D-Subthreshold Microelectronics Technology
Unified Conference (IEEE S3S)

Prospective authors should prepare a 2 page, camera ready abstract of their original work including illustration
(see Preparation of Abstracts for requirements and sample abstract).
If selected for conference presentation, authors will be given the opportunity to expand to a 3 page paper.

Submissions must be in Adobe PDF format and attached to a cover email.

The Cover E-Mail MUST Contain the Following:
Designated contact author

  • Full Name (first name and last name)
  • Mailing Address
  • Telephone Number (include country code if a non US number)
  • Email Address

Presenting author (even if it is the same as the contact author)

  • Full Name (first name and last name)
  • Email Address

Presentation Preference: Oral or Poster

Category of submission: 3D Integration / Silicon on Insulator (SOI) / Low-Power Circuits / Low-Power Devices

Authors may submit more than one paper to the conference. Each paper must be submitted separately following the above criteria.
Abstract acceptance will be based on Quality, Originality and Significance. Abstract submissions must be emailed to papers@s3sconference.org

Papers will be accepted until 11:59pm PDT 27 May 2019

Notification and  Communication

Submissions will be acknowledged via email to the designated contact author. If you submit a paper and do not receive notification within 2 business days, please email manager@s3sconference.org directly to follow up.

Contact authors will be notified of the Committee’s decision no later than 14 July, 2019

2019 Call for Papers
Preparation of Abstracts