Selected 2015 Talks
From the 2015 Plenary Talks, Session 1.3
Tsu-Jae King Liu; Department of Electrical Engineering and Computer Sciences, University of California at Berkeley
Sustaining the Silicon Revolution from 3-D Transistors to 3-D Integration
Copyright IEEE 2015
From the 2015 Invited Talks on M3DI, Session 6c.2
Eric Pabo; EV Group (EVG)
Heterogeneous integration enabled by advanced wafer bonding
Plenary Speakers
Advanced channel materials for the semiconductor industry
Nadine Collaert, imec
Advanced channel materials for the semiconductor industry
Tsu-Jae King Liu, UC Berkeley
New Game-Changing Product Applications Enabled by SOI
Gary Patton, GLOBALFOUNDRIES
Needs and benefits of SOI integration and die stacking for power management applications
Hans Stork, ON Semiconductor
The Past and Future of Extreme Low Power (xLP) SoC Transistor, embedded memory and backend Technology
Geoffrey Yeap, Qualcomm
SOI Invited Speakers
Engineered Substrates for Moore and More than Moore’s Law
Christophe Maleville, Soitec
GlobalFoundries 22FDX-rfa TM Fully-Depleted Independent Multi-Gate Technology for Highly-Integrated RF
Thomas G. McKay, GlobalFoundries
High Voltage SOI Technology
Piet Wessels, NXP
Special Characterization Techniques for Advanced FDSOI Process
Sorin Cristoloveanu, IMEP
Opportunities and Challenges of Nanowire-based CMOS technology
Sylvain Barraud, CEA-Leti
SubVt Invited Speakers
Negative Capacitance in Ferroelectric Materials and Implications for Steep Transistors
Sayeef Salahuddin, UC Berkeley
Frictionless wearable technology: the key to unleashing the power of wearable sensors for health and lifestyle
Chris Van Hoof, IMEC
Low Power Design: Ramping to Production
Christophe Chevallier, Ambiq Micro
CMOSS Reliability Challenges and the Low Power Domain
Chetan Prasad, Intel Corporation
Low Voltage Devices and Circuits for Energy-Starved Systems
Steven Vitale, MIT Lincoln Laboratory
3D Invited Speakers
Ultrathin Chips for Flexible Electronics and 3D ICs
Joachim Burghartz, Institute for Microelectronics Stuttgart
Technology scaling: the CoolCube™ paradigm
Fabien Clermidy, CEA-Leti
Emerging 3DVLSI: Opportunities and Challenges
Yang Du, Qualcomm
Vacuum as New Element of Transistor
Jin-Woo Han, Center for Nanotechnology, NASA Ames Research Center
Monolithic Three Dimensional Integration for Memory Scaling and Processing in Memory
Subramanian Iyer, UCLA, Electrical Engineering Department
From Nanodevices to Nanosystems: The N3XT Information Technology
Subhasish Mitra, Stanford University
Heterogeneous Integration Enabled by Advanced Wafer Bonding
Eric Pabo , EV Group (EVG)
Epitaxial Layer Transfer Technology and Application
Takao Yonehara, Applied Materials Inc.
Logic/Memory Hybrid 3D Sequentially Integrated Circuit Using Low Thermal Budget Laser Process
Chi-Chao Yang, National Nano Device Laboratories (NDL)
