2019 Call for Papers

2019 Call for Papers

The IEEE SOI-3D-Subthreshold Microelectronics Technology
Unified Conference (IEEE S3S)

This year we welcome papers in the areas of SOI, Low-Voltage Devices, Low-Power Circuits and 3D Integration.
Specifically in the following areas:

Silicon on Insulator (SOI)Technology

  • Fully Depleted Silicon on Insulator Technology
  • Advanced Materials, Substrate and Processes
  • Device Physics, Characterization and Modelling
  • Sensors, MEMS, BioMEMS
  • Non-Digital Devices and Applications (RF, High-Voltage, Photonics, Analog…)
  • Novel SOI Structures, Circuits and Applications
  • SOI Design, Circuits and Applications

Low-Voltage Devices

  • Low-Dimensional (1D, 2D) Transistors
  • Tunnel FETs
  • Negative Capacitance FETs
  • Piezoelectric FETs
  • Nano-Electromechanical Switches
  • Low Voltage Memory Technologies
  • Metal-Insulator Transitional Devices
  • Spintronic Devices

Low-Power Circuits

  • Low-Power and Ultra-Low-Power Digital Circuits
  • Energy Efficient Designs and Methodologies
  • Power Management Techniques
  • Asynchronous Circuits
  • Energy Harvesting Solutions
  • Low Power, Reliable and Resilient Solutions
  • Analog/Mixed-Signal Circuits for Wireless Communications
  • Innovative ICs
  • Near Threshold and Sub-Threshold Designs
  • Low Power Applications: IoT, Automotive, Data Mining …

3D Integration

  • System in Package
  • Through Silicon Via (TSV) Technology
  • 3D System Integration
  • Fabrication Techniques and Bonding Methods
  • Design and Test Methodologies
  • Processes for Multi Wafer Stacking
  • 3D IC EDA and Design Technology
  • Heterogeneous Structures
  • 3D Manufacturing and Logistics
  • Reliability of 3D Circuits
  • Fault Tolerant 3D Designs

2019 Call for Papers
Abstract Submission
Preparation of Abstracts