Executive Committee
Senior Committee
SOI Technology Committee
3D Technology Committee
Low-Voltage Devices Committee
Low-Power Circuits Committee
Executive Committee
-
Mostafa Emam
General Chair
Incize -
Shawn Thomas
SOI Technology Committee Chair
GlobalWafers -
Nuo Xu
Low Voltage Devices Committee Chair
Samsung -
Bruce Doris
Treasurer
IBM -
Jean-Eric Michallet
Sponsorship Chair
CEA-Leti -
Ali Khakifirooz
Secretary
Intel
-
Bich-Yen Nguyen
Technical Program Chair
Soitec -
Paul Franzon
3D Technology Chair
North Carolina State University -
Philippe Flatresse
Low Power Circuits Committee Chair
Dolphin Design -
Nobuyuki Sugii
Publicity Chair – Asia
Hitachi -
Nadine Collaert
Publicity Chair – Europe
imec
Senior Committee
-
Joao Antonio Martino
Digital Communications Chair
University of São Paulo -
Imran Bashir
Short Course Chair
Cypress Semiconductors -
Jing Wan
Awards Chair
Fudan University
Yuh-Yue Chen
Multimedia Chair
RichWave Technology Group
-
Michelly de Souza
Poster Session Chair
Centro Universitário FEI -
Jon Cheek
Rump Session Chair
SOI Industry ConsortiumMostafa Emam
Tutorial Coordinator
Incize
SOI Technology Committee
-
Shawn Thomas
GlobalWafers -
Siva Adusumilli
GlobalFoundries -
Mike Alles
Vanderbilt University -
Fred Allibert
Soitec -
Gary Bronner
Rambus -
Yuh-Yue Chen
RichWave Technology Corp -
Kangguo Cheng
IBM
-
Bruce Doris
IBM -
Alain Duvallet
pSemi -
Mostafa Emam
Incize -
Olivier Faynot
CEA-Leti -
Samuel Fung
TSMC -
Pascale Gouker
MIT Lincoln Laboratory -
Mark Hall
NXP
-
Michel Haond
STMicroelectronics -
Toshiro Hiramoto
University of Tokyo -
Keiji Ikeda
Toshiba -
Dimitri Lederer
Global Foundries -
Joao Antonio Martino
University São Paulo -
Meishoku Masahara
National Institute of AIST -
Bich-yen Nguyen
Soitec
-
Yasuhisa Omura
Kansai University -
Mario Pelella
On Semiconductor -
Jamie Schaefer
GlobalFoundries - Nobuyuki Sugii
Hitachi
- Yoshiki Yamamoto
Renasas
-
Yi Zhao
Zhejiang University -
Huilong Zhu
Institute of Microelectronics
3D Technology Committee
-
Paul Franzon
North Carolina State University -
Eric Beyne
imec -
Andy Carter
Teledyne -
Yang Du
Vanguard International Semiconductor -
Mukta Farooq
IBM
-
Eugene Fitzgerald
MIT -
Jin-Woo Han
NASA -
Subu Iyer
UCLA -
Amandine Jouve
CEA-Leti -
Sung-Kyu Lim
Georgia Institute of Technology
-
Tsu-Jae King Liu
University of California Berkeley -
Zvi Or-Bach
MonolithIC 3D -
Robert Patti
nHanced Semiconductors -
Arifur Rahman
Intel -
Chuan Seng Tan
Nanyang Technological University
-
Thomas Uhrmann
EVG -
Maud Vinet
CEA-Leti -
S.J. Ben Yoo
University of California, Davis -
Philip Wong
Stanford University
Low-Voltage Devices Committee
-
Nuo Xu
Samsung -
Lew Cohn
NRO -
Michelly de Souza
Centro Universitário FEI -
Michael Fritze
Potomac Institute -
Ru Huang
Peking University
-
Louis Hutin
CEA-Leti -
Ali Khakifrooz
Intel -
Jong-Ho Lee
Seoul National University -
Farnaz Niroui
MIT -
Dan Radack
Institute for Defense Analyses
-
Alan Seabaugh
University of Notre Dame -
Changhwan Shin
University of Seoul -
Steven Vitale
MIT Lincoln Laboratory -
Jing Wan
Fudan University -
Lan Wei
University off Waterloo
-
Eli Yablonovitch
University of California, Berkeley -
Jeng-Bang (Tony) Yau
IBM -
David Zubiai
University of Texas, El Paso
Low-Power Circuits Committee
-
Philippe Flatresse
Dolphin Design -
Khaled Ahmed
Intel -
Bevan Baas
University of California, Davis -
Imran Bashir
Cypress Semiconductors
-
Edith Beigne
Facebook -
David Bol
Université Catholique de Louvain -
Jeff Cunningham
NXP -
Patrick Drennan
Qualcomm
-
Stéphane Emery
CSEM -
Alex Fish
Bar-Ilan University -
Sumeet Gupta
Purdue University -
Vincent Huard
Dolphin Design
-
Lauri Koskinen
University of Turku -
Davide Rossi
University di Bologna -
Mingoo Seok
Columbia University -
Makoto Takamiya
University of Tokyo